Photonic Wire Bonding as a Novel Technology for Photonic Chip Interfaces (Paperback)

Photonic Wire Bonding as a Novel Technology for Photonic Chip Interfaces By Nicole Lindenmann Cover Image

Photonic Wire Bonding as a Novel Technology for Photonic Chip Interfaces (Paperback)

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To create photonic multi-chip modules, integrated photonic chips need to be connected internally and to external glass fibers. A novel approach to address this task is the concept of photonic wire bonding, where free-standing polymer waveguides are printed in-situ by two-photon polymerization. This book contains a detailed description of the methodology of photonic wire bonding together with a number of key experiments.

This work was published by Saint Philip Street Press pursuant to a Creative Commons license permitting commercial use. All rights not granted by the work's license are retained by the author or authors.

Product Details ISBN: 9781013279041
ISBN-10: 1013279042
Publisher: Saint Philip Street Press
Publication Date: October 9th, 2020
Pages: 254
Language: English